13th/12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake/Alder Lake) Workstation-grade Fanless Embedded System with compact Hailo-8™ AI accelerator, max 5 2.5G LAN with 4 PoE+, 4 Front-access M.2 SSD Tray, DC 9V to 50V, High Performance, Rugged, -40°C to 65°C Extended Temperature.
8th Gen Intel® Core™ U-series Processor (Whiskey Lake) Ultra-slim Fanless Edge AI Computing System with compact Hailo-8™ AI accelerator, 4 GigE LAN with 2 PoE+, 2 DDR4, 4 USB 3.1, 4 COM RS-232/422/485, 16 Isolated DIO, 1 Mini PCIe, 3 M.2, Fanless, Expandable, 0°C to 60°C
The latest 12th Gen Intel Core i9/i7/i5/i3 processor running with Intel R680E Chipset (former codename : Alder Lake-S), up to 65W TDP CPU supported. New performance hybrid architecture supports up to 1.36x faster single-thread performance and up to 1.35x faster multi thread performance vs. 10th Gen Intel Core processors
10th Gen Intel® Xeon®/Core™ i9/i7/i5/i3 Processor (Comet Lake) Workstation-grade Fanless Embedded System, 9 GigE LAN with 3 2.5 GigE LAN and 4 PoE+, 2 Front-access SSD/HDD Tray, 3 M.2 Socket, Isolated DIO, 9V to 50V DC, High Performance, Rugged, -40°C to 75°C Extended Temperature.
Workstation-grade 9th/8th Gen Intel® Xeon®/Core™ i7/i5/i3 (Coffee Lake) with Intel® C246 chipset, Fanless Embedded System, 9 GigE LAN with 4 PoE+, 2 Front-access SSD/HDD Tray, 2 M.2 Socket, up to 6 USB 3.1, Isolated DIO, High Performance, Rugged, -40°C to 75°C Extended Temperature
Workstation-grade Intel® Xeon®/Core™ i7/i5/i3 (Kaby Lake/Skylake) Fanless Embedded System with Intel® C236, 9 GigE LAN with 4 PoE+, 2 Front-access SSD Tray, 3 SIM, 6 USB 3.0, M2DOM, Isolated DIO, High Performance, Rugged, -40°C to 75°C Extended Temperature