The latest 12th Gen Intel Core i9/i7/i5/i3 processor running with Intel R680E Chipset (former codename : Alder Lake-S), up to 65W TDP CPU supported. New performance hybrid architecture supports up to 1.36x faster single-thread performance and up to 1.35x faster multi thread performance vs. 10th Gen Intel Core processors
Main Features
- 16-core 12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Alder Lake-S) with intelligent workload optimization, up to 36% CPU performance improved
- Intel® UHD Graphics 770 driven by Intel® Xe Architecture, with max 94% graphics performance and 181% GPU image classification inference performance enhanced
- 8 Independent 2.5G LAN with 4 IEEE 802.3at PoE+
- 4 Front-access M.2 SSD Tray, 6 USB 3.2 Gen 2
- DC 9V to 50V Power Input, Software Ignition Control
- Supports Intel® vPro, TPM 2.0 and Time-Sensitive Networking (TSN)
- Optional VHub One-Stop AIoT Solution Service supports OpenVINO based AI accelerator and advanced Edge AI applications
Overview
Powered by 12th generation 16-core Intel® Core™ i9/i7/i5/i3 processor (Alder Lake) with Intel® R680E chipset, fanless -40°C to 75°C operating temperature, multiple 10G LAN/2.5G LAN/GigE LAN/SIM socket configuration,max 6 USB 3.2 Gen 2 connections supporting up to 10Gbps data rate, outstanding system performance, 5G/WiFi 6/4G/3G/LTE/GPRS/UMTS mobile availability, 9V to 50V power input. Software ignition power control and rugged reliability in harsh environments, all-in-one integrated features, Vecow ECX-3000 Series Fanless Embedded System is your new generation choices for Machine Vision, In-vehicle Computing, Public Security, Factory Automation, Intelligent Transportation System (ITS), Robotic Control, AMR/AGV, Deep Learning, and any Edge AI applications.
Specifications
| System |
| Processor |
12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Alder Lake-S) |
| Chipset |
Intel® R680E Chipset |
| BIOS |
AMI |
| SIO |
IT8786E |
| Memory |
2 DDR4 3200MHz SO-DIMM, up to 64GB (ECC/Non-ECC) |
| OS |
Windows 10, Linux |
| I/O Interface |
| Serial |
Up to 4 COM RS-232/422/485 |
| USB |
6 USB 3.2 Gen 2 |
| Isolated DIO |
16 Isolated DIO : 8 DI, 8 DO (Optional) |
| LED |
Power, HDD, PoE, Wireless |
| SIM Card |
2 External SIM Card Sockets |
| RTC Battery |
Front-access RTC Battery |
| Expansion |
| Mini PCIe |
1 Mini PCIe Socket for PCIe/USB/SIM Card/Optional mSATA |
| M.2 |
- 1 M.2 Key B Socket (3042/3052)
- 1 M.2 Key E Socket (2230)
|
| SUMIT A, B |
2 SUMIT Slot (Optional) |
| Graphics |
| Graphics Processor |
Intel® UHD Graphics 770 driven by Intel® Xe Architecture |
| Interface |
4 independent displays :
- 2 DisplayPort : Up to 7680 x 4320 @60Hz/5120 x 2880 @60Hz
- 1 DVI-I : Up to 1920 x 1080 @60Hz
- 1 HDMI : Up to 4096 x 2160 @60Hz
|
| Storage |
| SATA |
2 SATA III (6Gbps) support S/W RAID 0, 1 |
| mSATA |
1 SATA III (Mini PCIe Type, 6Gbps) |
| M.2 |
1 M.2 Key M Socket (2280, PCIe x4) |
| Storage Device |
- Front-access 2.5" SSD/HDD Tray
- 4 Front-access M.2 Key M SSD Tray (ECX-3000 PoES)
|
| Audio |
| Audio Codec |
Realtek® ALC888S-VD, 7.1 Channel HD Audio |
| Audio Interface |
1 Mic-in, 1 Line-out |
| Ethernet |
| LAN 1 |
Intel® I219LM GigE LAN supports iAMT |
| LAN 2 |
Intel® I225 2.5GigE LAN supports TSN |
| 2.5G PoE |
| LAN 3 to LAN 6 |
2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I225 |
| 2.5G Ethernet (ECX-3025R/3025) |
| LAN 7 to LAN 9 |
Intel® I225 2.5GigE LAN |
| 10G Ethernet (ECX-3071XR/3071X) |
| LAN 7 to LAN 8 |
Intel® X710-AT2 10GigE LAN |
| Power |
| Power Input |
DC 9V to 50V |
| Power Interface |
- 3-pin Terminal Block : V+, V-, Frame Ground
- 4-pin Mini-DIN
|
| Ignition Control |
16-mode Software Ignition Control |
| Remote Switch |
3-pin Terminal Block |
| Others |
| TPM |
Infineon SLB9670 supports TPM 2.0, SPI Interface |
| Watchdog Timer |
Reset : 1 to 255 sec./min. per step |
| Smart Mgmt. |
Wake on LAN, PXE supported |
| HW Monitor |
Monitoring temperature, voltages. Auto throttling control when CPU overheats. |
| Mechanical |
| Dimension |
260.0mm x 175.0mm x 79.0mm (10.24" x 6.89" x 3.11") |
| Weight |
3.8 kg (8.38 lb) |
| Mounting |
- Wallmount by mounting bracket
- DIN Rail Mount (Optional)
- 2U Rackmount (Optional)
|
| Environment |
| Operating Temperature |
35W TDP CPU :
-40°C to 75°C (-40°F to 167°F), Fanless
65W TDP CPU :
-40°C to 55°C (-40°F to 131°F), Fanless
2.5G Series :
-40°C to 70°C (-40°F to 158°F), Fanless
10G Series :
0°C to 50°C (32°F to 122°F), with Internal Fan
|
| Storage Temperature |
-40°C to 85°C (-40°F to 185°F) |
| Humidity |
5% to 95% Humidity, non-condensing |
| Relative Humidity |
95% @75°C |
| Shock |
- IEC 60068-2-27
- SSD : 50G @wallmount, Half-sine, 11ms
|
| Vibration |
- IEC 60068-2-64
- SSD : 5Grms, 5Hz to 500Hz, 3 Axis
|
| EMC |
CE, FCC, EN50155, EN50121-3-2 |
