13th/12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake/Alder Lake) Workstation-grade Fanless Embedded System with compact Hailo-8™ AI accelerator, max 5 2.5G LAN with 4 PoE+, 4 Front-access M.2 SSD Tray, DC 9V to 50V, High Performance, Rugged, -40°C to 65°C Extended Temperature.
Main Features
- Workstation-grade Platform : 13th/12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S/Alder Lake-S) running with Intel® R680E PCH supports max 65W TDP CPU
- Intel® UHD Graphics 770 driven by Intel® Xe Architecture, with max 94% graphics performance and 181% GPU image classification inference performance enhanced
- Compact Hailo-8™ AI Accelerator supports up to 26 Tera-Operations Per Second (TOPS) with best-in-class power efficiency of 3 TOPS/W
- 5 Independent 2.5G LAN with 4 IEEE 802.3at PoE+
- 4 Front-access M.2 SSD Tray, 6 USB 3.2 Gen 2
- DC 9V to 50V Power Input, Software Ignition Control
- Supports Intel® vPro, TCC, Time-Sensitive Networking (TSN), and TPM 2.0
- Optional VHub One-Stop AIoT Solution Service supports OpenVINO based AI accelerator and advanced Edge AI applications
Specifications
System |
Processor |
24-core 13th Gen Intel® Core? i9/i7/i5/i3 Processor (Raptor Lake-S) 16-core 12th Gen Intel® Core? i9/i7/i5/i3 Processor (Alder Lake-S)
|
Chipset |
Intel® R680E |
BIOS |
AMI |
SIO |
IT8786E |
Memory |
2 DDR4 3200MHz SO-DIMM, up to 64GB |
OS |
Windows 10, Linux |
AI Accelerator |
Processor |
Hailo-8? AI Processor, up to 26 TOPS |
Framework |
TensorFlow, ONNX |
I/O Interface |
Serial |
Up to 4 COM RS-232/422/485 |
USB |
6 USB 3.2 Gen 2 |
Isolated DIO |
16 Isolated DIO : 8 DI, 8 DO (Optional) |
LED |
Power, HDD, PoE, Wireless |
SIM Card |
2 External SIM Card Sockets |
RTC Battery |
Front-access RTC Battery |
Expansion |
Mini PCIe |
1 Mini PCIe Socket for PCIe/USB/SIM Card/Optional mSATA |
M.2 |
- 1 M.2 Key B Socket (3042/3052, SATA/USB 3(Default)/USB 2)- 1 M.2 Key E Socket (2230, PCIe x2/USB) |
SUMIT A, B |
2 SUMIT Slot (Optional) |
Graphics |
Graphics Processor |
Intel® UHD Graphics 770 driven by Intel® Xe Architecture |
Interface |
4 independent displays :- 2 DisplayPort : Up to 7680 x 4320 @60Hz/5120 x 2880 @60Hz- 1 DVI-I : Up to 1920x 1080@60Hz- 1 HDMI : Up to 1920×1080 @ 60Hz |
Storage |
SATA |
2 SATA III (6Gbps) support S/W RAID 0, 1 |
mSATA |
1 SATA III (Mini PCIe Type, 6Gbps) |
Storage Device |
- Front-access 2.5" SSD/HDD Tray- 4 Front-access M.2 Key M SSD Tray(ECX-3000 PoES AI) |
Audio |
Audio Codec |
Realtek® ALC888S-VD, 7.1 Channel HD Audio |
Audio Interface |
1 Mic-in, 1 Line-out |
Ethernet |
LAN 1 |
Intel® I219LM GigE LAN |
LAN 2 |
Intel® I2262.5GigE LAN supports TSN |
2.5G PoE |
LAN 3 |
2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226 |
LAN 4 |
2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226 |
LAN 5 |
2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226 |
LAN 6 |
2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226 |
Power |
Power Input |
DC 9V to 50V |
Power Interface |
- 3-pin Terminal Block : V+, V-, Frame Ground- 4-pin Mini-DIN |
Ignition Control |
16-mode Software Ignition Control |
Remote Switch |
3-pin Terminal Block |
Others |
TPM |
Infineon SLB9670 supports TPM 2.0, SPI Interface |
Watchdog Timer |
Reset : 1 to 255 sec./min. per step |
Smart Mgmt. |
Wake on LAN, PXE supported |
HW Monitor |
Monitoring temperature, voltages. Auto throttling control when CPU overheats. |
Mechanical |
Dimension |
260.0mm x 175.0mm x 79.0mm (10.24" x 6.89" x 3.11") |
Weight |
3.8 kg (8.38 lb) |
Mounting |
- Wallmount by mounting bracket- DIN Rail Mount (Optional)- 2U Rackmount (Optional) |
Environment |
Operating Temperature |
35W TDP CPU:-40°C to 65°C (-40°F to 149°F), Fanless65W TDP CPU :-40°C to 45°C (-40°F to 113°F), FanlessECX-3000-PoES AI :-40°C to 45°C (-40°F to 113°F), Fanless |
Storage Temperature |
-40°C to 85°C (-40°F to 185°F) |
Humidity |
5% to 95% Humidity, non-condensing |
Relative Humidity |
95% @65°C |
Shock |
- IEC 60068-2-27-SSD : 50G @wallmount, Half-sine, 11ms |
Vibration |
- IEC 60068-2-64-SSD : 5Grms, 5Hz to 500Hz, 3 Axis |
EMC |
CE, FCC, EN50155, EN50121-3-2 |